Low-loss power semiconductor material (corundum-structured gallium oxide)
High-performance rare-earthfree magnet (FeNi superlattice)
Ultra-lightweight conductor material (carbon nanotube)

Double-sided cooler


Power card (power semiconductor element)

DENSO’s newly developed double-sided cooling technology prevents temperature increases in the power semiconductor which converts the current. DENSO also has successfully enhanced the electric power density (output per unit volume), reducing both its size and its weight.

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